Fast analysis of cylindrical microstrip lines printed on substrates composed of multiple layers
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John Wiley and Sons Inc.
This letter presents an analysis of microstrip lines that are printed on substrates composed of numerous dielectric layers using a fast technique that comprises the full-wave equivalent circuit and the discrete mode matching method. The validation of the proposed formulation has been done with a commercial package based on the finite-element method and very good agreement has been obtained. As a special application of our technique, we consider the analysis of microstrip lines printed on substrates with dielectric constants that vary according to given graded-index profiles. The profiles are modelled by replacing the substrate by numerous homogeneous dielectric layers. © 2010 Wiley Periodicals, Inc.